Copper Plating Corrosion Study in Certain Environments
View/ Open
Date
2013Author
Cantaragiu, A.M.
Gavril (Donose), M.D.
Vladu (Radu), D.C.
Gheorghieș, C.
Tigău, N.
Cantaragiu, C.M.
Metadata
Show full item recordAbstract
Copper plating was performed on nickel substrate by means of the
potentiostatic electrodeposition method from a sulphate electrolyte solution. The
copper coatings morphology was studied by means of the optical and electronic
scanning microscopy techniques. The uniform electrodeposited films have a thickness
of about 15 μm measured in cross-section. The corrosion behaviours of nickel
substrate and copper films in different corrosive environments were studied. The
corrosion study was performed by means of the linear polarisation method in four
acid environments: 0.5 M H2SO4, HCl, HNO3 and glacial CH3COOH. From the
recorded Tafel curves it was possible to obtain some information about the corrosion
rate and the polarization resistance. In order to confirm these results, the
gravimetric parameter was calculated by means of the “mass loss” method. By
means of the X-ray diffraction analysis, the crystallographic structure of the
specimens before and after corrosion was revealed. By means of the
spectrophotometer device, the optical properties of the specimens were analysed
Collections
- 2012 fascicula9 nr1 [14]